Shenzhen Hothree Technology Co., Ltd.

Gap Pad® HC 3.0 is a soft gap filling material
rated at a thermal conductivity of 3.0 W/m-K.
The material offers exceptional thermal
performance at low pressures due to a
unique 3.0 W/m-K filler package and
low-modulus resin formulation.The enhanced
material is well suited for high performance
applications requiring low assembly stress.
Gap Pad® HC 3.0 maintains a conformable
nature that allows for excellent interfacing
and wet-out characteristics, even to surfaces
with high roughness and/or topography.
Gap Pad® HC 3.0 is offered with natural
inherent tack on one side of the material,
eliminating the need for thermally-impeding
adhesive layers.The material’s natural inherent
tack allows for stick-in-place characteristics
during assembly. Gap Pad® HC 3.0 is supplied
with protective liners on both sides.The top
side has minimal tack for ease of handling.