Gap Pad 5000S35, GAP PAD TGP 5000

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Shenzhen Hothree Technology Co., Ltd

Address: Building F3, Jinyucheng Park, Bantian Street, Longgang District, Shenzhen

Tel：0086-755-86652465

Fax：0086-755-88374575
Email: sales@hothree.com
jason@hothree.com
Wechat: lijianming-007

Factory Address: Building 1, Deyongjia Industrial Park, Guangqiao Road, Yulu Community, Guangming District, Shenzhen

Gap Pad 5000S35, GAP PAD TGP 5000

特点和优点Features and Benefits
• High thermal conductivity: 5 W/m-K
• Highly conformable,“S-Class” softness
• Natural inherent tack reduces interfacial
thermal resistance
• Conforms to demanding contours
and maintains structural integrity with
little or no stress applied to fragile
component leads
• Fiberglass reinforced for puncture, shear
and tear resistance
• Excellent thermal performance at
low pressures
· 固有的粘性降低界面热阻

Hotline：0086-755-86652465

Product introduction

Gap Pad 5000S35 is a fiberglass-reinforced
filler and polymer featuring a high thermal
conductivity.The material yields extremely soft
characteristics while maintaining elasticity and
conformability.The fiberglass reinforcement
provides easy handling and converting, added
electrical isolation and tear resistance.The
inherent natural tack on both sides assists in
application and allows the product to effectively
fill air gaps, enhancing the overall thermal
performance.The top side has reduced tack
for ease of handling. Gap Pad 5000S35 is ideal
for high-performance applications at low
mounting pressures.

Typical Applications
• CDROM / DVD ROM
• Voltage Regulator Modules ( VRMs) and POLs
• Thermally-enhanced BGAs
Configurations Available:
• Die-cut parts are available in any shape or size, separated or in sheet form
Building a Part Number Standard Options
• Memory packages / modules
• PC Board to chassis
• ASICs and DSPs
Note: Resultant thickness is defined

Shenzhen Hothree Technology Co., Ltd.

Product search

Gap Pad 5000S35, GAP PAD TGP 5000