BOND-PLY TBP 1400LMS-HD

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Shenzhen Hothree Technology Co., Ltd

Address: Building F3, Jinyucheng Park, Bantian Street, Longgang District, Shenzhen

Tel：0086-755-86652465

Fax：0086-755-88374575
Email: sales@hothree.com
jason@hothree.com
Wechat: lijianming-007

Factory Address: Building 1, Deyongjia Industrial Park, Guangqiao Road, Yulu Community, Guangming District, Shenzhen

BOND-PLY TBP 1400LMS-HD

Features and Benefits
• TO-220 thermal performance: 2.3°C/W,
initial pressure only lamination
• Exceptional dielectric strength
• Very low interfacial resistance
• 200 psi adhesion strength
• Continuous use of -60°C to 180°C
• Eliminates mechanical fasteners

Hotline：0086-755-86652465

Product introduction

BERGQUIST® BOND-PLY TBP 1400LMS-HD
is a thermally conductive heat curable
laminate material. The product consists of
a high performance thermally conductive
low modulus silicone compound coated
on a cured core, and double lined with
protective films. The low modulus silicone
design effectively absorbs mechanical
stresses induced by assembly-level
CTE mismatch, shock and vibration
while providing exceptional thermal
performance (vs. PSA technologies) and
long-term integrity. BERGQUIST® BONDPLY
TBP 1400LMS-HD will typically be
used for structurally adhering power
components and PCBs to a heat sink.

Shenzhen Hothree Technology Co., Ltd.

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BOND-PLY TBP 1400LMS-HD