Shenzhen Hothree Technology Co., Ltd.

BERGQUIST® HI-FLOW THF 1600P consists
of a thermally conductive 55°C phase
change compound coated on a thermally
conductive polyimide film. The polyimide
reinforcement makes the material easy
to handle and the 55°C phase change
temperature minimizes shipping and
handling problems.
BERGQUIST® HI-FLOW THF 1600P
achieves outstanding values in voltage
breakdown and thermal performance. The
product is supplied on an easy release
liner for exceptional handling in high
volume manual assemblies. BERGQUIST®
HI-FLOW THF 1600P is designed for use
as a thermal interface material between
electronic power devices requiring
electrical isolation to the heat sink.
Henkel suggests the use of spring clips
to assure constant pressure with the
interface and power source. Please
refer to thermal performance data to
determine nominal spring pressure for
your application.
We produce thousands of specials. Tooling
charges vary depending on tolerances and
complexity of the part.