Shenzhen Hothree Technology Co., Ltd.

 Q-Pad II is a composite of aluminum foil coated
on both sides with thermally / electrically
conductive Sil-Pad rubber.The material is
designed for those applications in which maximum
heat transfer is needed and electrical
isolation is not required. Q-Pad II is the ideal
thermal interface material to replace messy
thermal grease compounds.
Q-Pad II eliminates problems associated with
grease such as contamination of reflow solder
or cleaning operations. Unlike grease, Q-Pad II
can be used prior to these operations. Q-Pad II
also eliminates dust collection which can cause
possible surface shorting or heat buildup.