Shenzhen Hothree Technology Co., Ltd.

The Sil-Pad 800 family of thermally conductive insulation materials is designed for applications requiring high thermal performance andelectrical isolation.These applications also typically have low mounting pressures for component clamping.
Sil-Pad 800 material combines a smooth and highly compliant surface characteristic with high thermal conductivity.These features optimize the thermal resistance properties at low pressure. Applications requiring low component clamping forces include discrete semiconductors  (TO-220,TO-247 and TO-218) mounted with spring clips. Spring clips assist with
quick assembly but apply a limited amount of force to the semiconductor.The smooth surface texture of Sil-Pad 800 minimizes interfacial thermal resistance and maximizes  thermal performance.

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