Shenzhen Hothree Technology Co., Ltd.

The true workhorse of the Sil-Pad product
family, Sil-Pad 900S thermally conductive
insulation material, is designed for a wide
variety of applications requiring high thermal
performance and electrical isolation.These
applications also typically have low mounting
pressures for component clamping.
Sil-Pad 900S material combines a smooth
and highly compliant surface characteristic
with high thermal conductivity.These features
optimize the thermal resistance properties at
low pressures.
Applications requiring low component clamping
forces include discrete semiconductors
(TO-220,TO-247 and TO-218) mounted with
spring clips. Spring clips assist with quick
assembly and apply a limited amount of force
to the semiconductor.The smooth surface
texture of Sil-Pad 900S minimizes interfacial
thermal resistance and maximizes thermal
performance.

For more product information, please contact us