Shenzhen Hothree Technology Co., Ltd.

Bergquist Bond-Ply 400 is an un-reinforced,
thermally conductive, pressure sensitive
adhesive tape.The tape is supplied with
protective topside tabs and a carrier liner.
Bond-Ply 400 is designed to attain high bond
strength to a variety of “low energy” surfaces,
including many plastics, while maintaining high
bond strength with long term exposure to
heat and high humidity.
Typical Applications
Include:
Secure:
• Heat sink onto BGA graphic processor
• Heat sink to computer processor
• Heat sink onto drive processor
• Heat spreader onto power converter PCB
• Heat spreader onto motor control PCB
Configurations Available:
• Die-cut parts (supplied on rolls with easy
release, protective tabs)