Shenzhen Hothree Technology Co., Ltd.

BERGQUIST® HI-FLOW THF 1000F-AC is
a high performance, thermal interface
material for use between a computer
processor and a heat sink. BERGQUIST®
HI-FLOW THF 1000F-AC consists of a soft,
thermally conductive 55°C phase change
compound coated to the top surface of an
aluminum carrier with a soft, thermally
conductive adhesive compound coated to
the bottom surface to improve adhesion
to the heat sink.
Above the 55°C phase change
temperature, BERGQUIST® HI-FLOW THF
1000F-AC wets-out the thermal interface
surfaces and flows to produce low
thermal impedance.
BERGQUIST® HI-FLOW THF 1000F-AC
requires pressure from the assembly to
cause material flow. The HI-FLOW coatings
resist dripping in vertical orientation.
The material includes a base carrier liner
with differential release properties to
facilitate simplicity in roll form packaging
and application assembly. Please
contact Henkel Product Management
for applications that are less than 0.07
in. squared.