Shenzhen Hothree Technology Co., Ltd.

BERGQUIST® HI-FLOW THF 700UT is
designed as a pressure-sensitive thermal
interface material for use between a high
performance processor and a heat sink.
BERGQUIST® HI-FLOW THF 700UT is a
thermally conductive 55°C phase change
composite with inherent tack. The
material is supplied on a polyester carrier
liner and is available with high-visibility
protective tabs.
Above its phase change temperature,
BERGQUIST® HI-FLOW THF 700UT wetsout
the thermal interface surfaces and
flows to produce the lowest thermal
impedance. The material requires
pressure of the assembly to cause flow.
Application Methods:
Hand-apply BERGQUIST® HI-FLOW THF
700UT to a room-temperature heat sink.
The BERGQUIST® HI-FLOW THF 700UT pad
exhibits inherent tack and can be handapplied
similar to an adhesive pad. The
tab liner can remain on the heat sink and
pad throughout shipping and handling
until it is ready for final assembly.