BERGQUIST® HI-FLOW THF 500 is a
film-reinforced phase change material.
The product consists of a thermally
conductive 65°C phase change compound
coated on PEN film. BERGQUIST® HI-FLOW
THF 500 is designed to be used as a
thermal interface material between
electronic power devices that require
electrical isolation and a heat sink.
The reinforcement makes BERGQUIST®
HI-FLOW THF 500 easy to handle, and the
65°C phase change temperature of the
coating material eliminates shipping and
handling problems. The PEN film has a
continuous use temperature of 150°C.
BERGQUIST® HI-FLOW THF 500 is tackfree
and scratch-resistant at production
temperature and does not require
a protective liner in most shipping
situations. The material has the thermal
performance of 2 to 3 mil mica and grease
assemblies.