Shenzhen Hothree Technology Co., Ltd.

GAP FILLER TGF 1500/Gap Filler 1500

BERGQUIST® GAP FILLER TGF 1500 is a
two-part, high performance, thermally
conductive, liquid gap-filling material,
which features exceptional slump
resistance and high shear thinning
characteristics for optimized consistency
and control during dispensing. The mixed
system will cure at room temperature
and can be accelerated with the
addition of heat. Unlike cured thermal
pad materials, a liquid approach offers
infinite thickness variations with little
or no stress to the sensitive components
during assembly. BERGQUIST® GAP
FILLER TGF 1500 exhibits low level natural
tack characteristics and is intended
for use in applications where a strong
structural bond is not required. As cured,
BERGQUIST® GAP FILLER TGF 1500
provides a soft, thermally conductive,
form-in-place elastomer that is ideal for
fragile assemblies and filling unique and
intricate air voids and gaps.