Shenzhen Hothree Technology Co., Ltd.

BERGQUIST® GAP FILLER TGF 2000 is a
high performance, thermally conductive,
liquid gap-filling material supplied as
a two-component, room or elevated
temperature curing system. The material
provides a balance of cured material
properties and good compression set
(memory). The result is a soft, form-inplace
elastomer ideal for coupling “hot”
electronic components mounted on PC
boards with an adjacent metal case or
heat sink. Before cure, it flows under
pressure like grease. After cure, it won’t
pump from the interface as a result of
thermal cycling and is dry to the touch.
Unlike cured gap-filling materials, the
liquid approach offers infinite thickness
variations with little or no stress
during displacement and assembly. It
also eliminates the need for specific
pad thickness and die-cut shapes for
individual applications.
BERGQUIST® GAP FILLER TGF 2000 is
intended for use in thermal interface
applications when a strong structural
bond is not required.