Shenzhen Hothree Technology Co., Ltd.

BERGQUIST® GAP FILLER TGF 3600 is
a two-component, liquid gap-filling
material, cured at either room or elevated
temperature, featuring ultra-high thermal
performance and outstanding softness.
Prior to curing, the material maintains
good thixotropic characteristics as well
as low viscosity. The result is a gel-like
liquid material designed to fill air gaps
and voids yet flow when acted upon by
an external force (e.g., dispensing or
assembly process). The material is an
excellent solution for interfacing fragile
components with high topography and/
or stack-up tolerances to a universal heat
sink or housing. Once cured, it remains a
low modulus elastomer designed to assist
in relieving CTE stresses during thermal
cycling yet maintain enough modulus to
prevent pump-out from the interface.
BERGQUIST® GAP FILLER TGF 3600 will
lightly adhere to surfaces, thus improving
surface area contact. BERGQUIST® GAP
FILLER TGF 3600 is not designed to be a
structural adhesive.