Shenzhen Hothree Technology Co., Ltd.

BERGQUIST® GAP FILLER TGF 1000
is a thermally conductive, liquid gap
filling material. It is supplied as a
two-component, room or elevated
temperature curing system. The material
is formulated to provide a balance of
cured material properties highlighted by
a low modulus and good compression set
(memory). The result is a soft, thermally
conductive, form-in-place elastomer ideal
for coupling “hot” electronic components
mounted on PC boards with an adjacent
metal case or heat sink. Before cure,
BERGQUIST® GAP FILLER TGF 1000 flows
under pressure like a grease. After cure,
it does not pump from the interface as a
result of thermal cycling. Unlike thermal
grease, the cured product is dry to the
touch. Unlike cured gap-filling materials,
the liquid approach offers infinite
thickness variations with little or no stress
during displacement and eliminates the
need for specific pad thickness and diecut
shapes for individual applications.
BERGQUIST® GAP FILLER TGF 1000 is
intended for use in thermal interface
applications when a strong structural
bond is not required.