GAP FILLER 1000SR (Two-Part)/Gap Filler 1000SR

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Shenzhen Hothree Technology Co., Ltd

Address: Room 220,Building C2,Zhonghao New Town,Bantian Street,Longgang District,Shenzhen,China

Tel：0086-755-86652465

Fax：0086-755-88374575
Email: sales@hothree.com
jason@hothree.com
Wechat: lijianming-007

Factory Address: Building 1, Deyongjia Industrial Park, Guangqiao Road, Yulu Community, Guangming District, Shenzhen

GAP FILLER 1000SR (Two-Part)/Gap Filler 1000SR

Features and Benefits
• Thermal conductivity: 1.0 W/m-K
• Excellent slump resistance (stays
in place)
• Ultra-conforming, with excellent wetout
for low stress interface applications
• 100% solids – no cure by-products
• Excellent low- and high-temperature
mechanical and chemical stability

Hotline：0086-755-86652465

Product introduction

BERGQUIST® GAP FILLER TGF 1000SR is a
two-part, thermally conductive, liquid gap
filling material that features exceptional
slump resistance. The mixed system will
cure at room temperature and can be
accelerated with the addition of heat.
Unlike cured thermal pad materials, a
liquid approach offers infinite thickness
variations with little or no stress to
sensitive components during assembly.
As cured, BERGQUIST® GAP FILLER
TGF 1000SR provides a soft, thermally
conductive, form-in-place elastomer that
is ideal for fragile assemblies or for filling
unique and intricate air voids and gaps.
BERGQUIST® GAP FILLER TGF 1000SR
exhibits low level natural tack
characteristics and is intended for use
in applications where a strong structural
bond is not required.

Shenzhen Hothree Technology Co., Ltd.

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GAP FILLER 1000SR (Two-Part)/Gap Filler 1000SR