Shenzhen Hothree Technology Co., Ltd.

Features and Benefits
• Thermal conductivity: 1.1 W/m-K
• No silicone outgassing or extraction
• Ultra-conforming, designed for fragile and
low-stress applications
• Ambient and accelerated cure schedules
• 100% solids – no cure by-products
Gap Filler 1100SF is the thermal solution for
silicone-sensitive applications.The material is
supplied as a two-part component, curing at
room or elevated temperatures.The material
exhibits low modulus properties then cures
to a soft, flexible elastomer, helping reduce
thermal cycling stresses during operation and
virtually eliminating stress during assembly of
low-stress applications.
The two components are colored to assist
as a mix indicator (1:1 by volume).The mixed
system will cure at ambient temperature.
Unlike cured thermal pad materials, the liquid
approach offers infinite thickness variations with
little or no stress during assembly displacement.
Gap Filler 1100SF, although exhibiting some
natural tack characteristics, is not intended for
use in thermal interface applications requiring
a mechanical structural bond.
Features and Benefits
• Thermal conductivity: 1.1 W/m-K
• No silicone outgassing or extraction
• Ultra-conforming, designed for fragile and
low-stress applications
• Ambient and accelerated cure schedules
• 100% solids – no cure by-products