Shenzhen Hothree Technology Co., Ltd.

BERGQUIST® GAP FILLER TGF 1500LVO is
a two-part, high performance, thermally
conductive, liquid gap-filling material.
This material offers the high temperature
resistance and low modulus of a silicone
material with significantly lower levels
of silicone outgassing for use in siliconesensitive
applications.


The mixed material will cure at room
temperature and can be accelerated
with the addition of heat. As cured,
BERGQUIST® GAP FILLER TGF 1500LVO
provides a soft, thermally conductive,
form-in-place elastomer that is ideal for
fragile assemblies or for filling unique and
intricate air voids and gaps.
Liquid dispensed thermal materials offer
infinite thickness variations and impart
little to no stress on sensitive components
during assembly. BERGQUIST® GAP
FILLER TGF 1500LVO exhibits low level
natural tack characteristics and is
intended for use in applications where a
strong structural bond is not required.