Shenzhen Hothree Technology Co., Ltd.

BERGQUIST® GAP FILLER TGF 4000 is a
two-part, high performance, thermally
conductive, liquid gap-filling material.
The mixed material will cure at room
temperature and can be accelerated with
the addition of heat. BERGQUIST® GAP
FILLER TGF 4000 offers an extended
working time to allow greater flexibility
in the customer’s assembly process.
Liquid dispensed thermal materials offer
infinite thickness variations and impart
little to no stress on sensitive components
during assembly. BERGQUIST® GAP FILLER
TGF 4000 exhibits low level natural tack
characteristics and is intended for use
in applications where a strong structural
bond is not required.
As cured, BERGQUIST® Gap Filler TGF 4000
provides a soft, thermally conductive,
form-in-place elastomer that is ideal for
fragile assemblies or for filling unique and
intricate air voids and gaps.